Memory chip prices remain high, though conditions differ across segments, according to information The Paper obtained from storage-industry agents and distributors. Enterprise DRAM and SSDs are still rising, and consumer-grade memory is also rising, but prices in that segment are described as negotiable.
A staff member at a leading memory-chip agency told The Paper that further increases are assured because AI computing centers require large amounts of memory. Higher consumer prices, however, have made finished products harder to sell, so the consumer market is currently in a “prices negotiable” state.
The same person said leading memory manufacturers, including SK Hynix and Samsung, are unwilling to cut prices. They already have substantial long-term contracts tied to AI demand, and consumer-grade products that do not sell can be redirected to fill that demand. Secondary-market prices are changing quickly, and even experienced traders may not be able to control them.
A distributor owner separately confirmed to The Paper that secondary-market memory prices are still rising.
Based on earlier information from major upstream manufacturers, memory prices are expected to rise further toward the end of this year or early next year.
In October, South Korean media reported that Samsung Electronics is planning to raise 2027 supply prices for sixth-generation HBM4 to more than twice current levels—an increase of more than 100%—as products shift from fifth-generation HBM3E to HBM4.
Also in October, Taiwanese memory maker Nanya Technology notified customers of another increase in DRAM contract prices, with the largest rise reaching 20%. Asked about the reported increase, Nanya declined to comment on matters related to customer quotations.
On October 22, Goke Microelectronics sent customers and distributors a price-adjustment notice stating that a new round of increases for co-packaged KGD (Known Good Die) memory products would take effect in November 2026. It was the company’s second price increase this year and the first time it quoted in absolute U.S. dollar amounts rather than as a percentage.
The agency source said rising memory prices are putting heavy pressure on consumer-device makers, and that many companies have begun using recycled chips removed from used devices. Recycled material still accounts for a small share overall, but that share could grow.
A report from market-research firm TrendForce says reworked memory from disassembled devices is expected to represent 3% to 4% of the smartphone market in 2026 and could rise to 7% to 9% in 2027. Recycled 4GB LPDDR4X chips are mostly used in 4G phones priced below 1,299 yuan. For price-sensitive low-end products, the practice can ease higher material costs and help manufacturers keep selling prices competitive.
Recycled chips also create quality risks. The source, prior condition, and refurbishment of used memory can make consistent quality difficult to guarantee, affecting reliability and lifespan and increasing repair and warranty costs. Manufacturers must balance short-term cost savings against longer-term product quality and after-sales expense.
On PC DRAM supply, TrendForce said steady AI demand has led manufacturers to make preliminary plans to reduce PC DRAM supply in 2027. Related capacity pressure is relatively limited, however, and manufacturers still need strategic cooperation with customers for longer-term edge-AI applications, leaving some flexibility to moderate price increases. TrendForce estimates that PC DRAM contract prices will rise 13% to 18% quarter on quarter in the fourth quarter of 2026, a smaller increase than in the previous quarter.
Original article: The Paper